According to technical data from UTSOURCE and TDK/EPCOS , the B58944 features standard characteristics suitable for diverse applications. 10 kΩ ± 1% to ± 5% B-Value ( B25/50cap B sub 25 / 50 end-sub B25/100cap B sub 25 / 100 end-sub ) 3950 K (Typical) Tolerance ± 1% to ± 5% (Model dependent) Operating Temperature -55°C to +125°C Maximum Power (P₂₅) ≈ 200 mW Dissipation Factor ( δthdelta sub t h end-sub ) ≈ 3.5 mW/K (in air) Thermal Cooling Time Constant ( τctau sub c ) ≈ 12 s (in air) Lead Type Copper-clad Fe wire, tinned 2.1. The Resistance-Temperature (R/T) Curve

Parallel SRAM, which allows for rapid data access without the need for refresh cycles common in DRAM. Package Type: SOP-28 (Small Outline Package with 28 pins).

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This "helpful paper" is formatted as a , designed to give engineers and hobbyists the essential data needed for implementation.

Indicated by the "-70" suffix in its equivalent part numbers, signifying a 70ns access time.

Below is a technical summary of the component, which can serve as a reference paper for its datasheet. 1. Component Identification Manufacturer: NEC Electronics (now part of Renesas Electronics). Part Number: Functional Equivalent: $\mu$PD43256BGU-70L Common Branding:

The is a specialized automotive integrated circuit (IC) widely recognized as a critical core driver chip in engine control units (ECUs) . Manufactured primarily by NEC (with legacy production tied to Bosch automotive modules), this chip acts as an essential engine drive interface in systems like the Bosch EDC16, ME7.4.4, ME7.5, and EDC7.

256 Kibibits organized uniformly into a 32K x 8-bit architecture .