Modern electronics feature smaller solder balls, lead-free alloys, and thinner boards. These factors make assemblies brittle and prone to structural failure under physical stress. Critical Risk Factors
Which do you suspect is causing the stress? ipc-9704 pdf
Printed Circuit Assembly Strain Gage Test Guideline Modern electronics feature smaller solder balls
: Pressing heavy connectors, heatsinks, or daughter cards onto the main board. ipc-9704 pdf